FEI Celebrates Shipment of 1,000th Helios DualBeam System
FEI’s Helios Family has lead the DualBeam technology race and is widely used across the semiconductor, materials science, life sciences and oil & gas industries
Hillsboro, Ore.—FEI (NASDAQ: FEIC) today announced a milestone of the 1,000th Helios™ DualBeam system shipped since the product family was introduced in 2006. The 1,000th system was manufactured in FEI’s Brno plant and was shipped earlier this month to a semiconductor customer who is utilizing the system for advanced failure analysis on sub-20nm semiconductor devices.
The small DualBeam (SDB) platform combines a focused ion beam (FIB) and scanning electron microscope (SEM) to enable industry-leading three-dimensional (3D) characterization, analysis and image reconstruction, nano-prototyping (fabrication and testing), and high-quality transmission electron microscope (TEM) sample preparation for both research and industrial workflows. Originally developed for semiconductor manufacturing failure analysis, the Helios DualBeam has enabled

