HORIBA Advanced Techno, Co., Ltd. (hereinafter referred to as “HORIBA Advanced Techno”) announced that it has joined the co-creation evaluation platform “JOINT3,” led by Resonac Corporation (hereinafter referred to as “Resonac”).

JOINT3 is a co-creation platform in which global semiconductor materials, equipment, and design tools companies collaborate to promote the development of materials, equipment, and design tools optimized for panel-level organic interposers, using a prototype production line. At “APLIC (Advanced Panel Level Interposer Center),” the activity hub for JOINT3 to be established by Resonac, verification will be conducted in an environment close to actual device structures, accelerating technological development by participating companies.

HORIBA Advanced Techno has contributed to the advancement of semiconductor manufacturing processes through its strengths in water and liquid measurement technologies, which are essential to the semiconductor industry. As further performance improvements in semiconductors require innovation in next-generation semiconductor packaging technologies, many technical challenges remain. By leveraging the diverse core technologies in analysis, measurement, and control possessed by the HORIBA Group, the company aims to contribute to research and development and help address technical challenges within JOINT3.