Advanced DualBeam Technology Accelerates Time to Data for Failure Analysis, Process Development and Process Control in Semiconductor and Data Storage Manufacturing

HILLSBORO, Ore., July 13, 2009 — FEI Company (Nasdaq:FEIC – News), a leading provider of atomic-scale imaging and analysis systems, today announced the newest member of the Helios NanoLab(tm) family — the Helios NanoLab 1200 Full Wafer DualBeam(tm) system. The ability of the Helios NanoLab 1200 to analyze full wafers up to 300 mm improves the efficiency of semiconductor and data storage failure analysis and manufacturing support labs that need to deliver accurate data quickly to the production floor.

“We’ve designed the new Helios NanoLab 1200 DualBeam system to provide high productivity for failure analysis, process development and process control requirements,” said Larry Dworkin, product marketing manager for FEI’s full wafer systems. “The ability to introduce full wafers directly into the system allows users to navigate quickly to multiple features of interest based on design data or information from other inspection and defect detection tools. Fast switching between imaging and milling permits precise, efficient control of the cross sectioning process. Additionally, the system’s imaging resolution is better than any other instrument in its class, which ensures superior analytical results.”

The Helios NanoLab 1200 combines world-class scanning electron microscope (SEM) image resolution and fast switching between imaging and ion beam milling to deliver rapid, reliable, efficient cross-sectional analysis of structures and defects. Its ability to accommodate full wafers up to 300 mm eliminates the time required to re-establish the navigational coordinate system when working with wafer pieces.

“In the nearly two years since its introduction, our small-chamber Helios NanoLab DualBeam systems have been installed at every leading edge fab in the world,” said Rudy Kellner, vice president and general manager of FEI’s Electronics Market Division. “Now, for the first time, we can offer the same performance in a full wafer system.”

When the analysis demands the higher resolution capability of a dedicated scanning transmission electron microscope (S/TEM), FEI’s MultiLoader(tm) technology enables fast and secure lamellae sample transfer. FEI’s new automation software product, iFAST(tm), improves the quality and consistency of multiple, site-specific samples in a single session. Optional energy dispersive X-ray spectrometry (EDS) on thin samples offers compositional analysis of defects and structures.

The new Helios NanoLab 1200 DualBeam system is available for ordering immediately.

About FEI

FEI (Nasdaq:FEIC – News) is a leading diversified scientific instruments company. It is a premier provider of electron and ion-beam microscopes and tools for nanoscale applications across many industries: industrial and academic materials research, life sciences, semiconductors, data storage, natural resources and more. With a 60-year history of technological innovation and leadership, FEI has set the performance standard in transmission electron microscopes (TEM), scanning electron microscopes (SEM) and DualBeams(tm), which combine a SEM with a focused ion beam (FIB). FEI’s imaging systems provide 3D characterization, analysis and modification/prototyping with resolutions down to the sub-Angstrom (one-tenth of a nanometer) level. FEI’s NanoPorts in North America, Europe and Asia provide centers of technical excellence where its world-class community of customers and specialists collaborate. FEI has approximately 1800 employees and sales and service operations in more than 50 countries around the world. More information can be found at: www.fei.com.

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FEI Safe Harbor Statement

This news release contains forward-looking statements that include statements regarding the performance capabilities and benefits of the Helios NanoLab 1200 Full Wafer DualBeam system. Factors that could affect these forward-looking statements include but are not limited to delay or cancellation of additional development work to move the product from beta to release, technical problems arising during the beta phase, problems with our suppliers, delays in releasing the product, failure of the product or technology to perform as expected and achieve anticipated results, unexpected technology problems and our ability to manufacture, ship and deliver the tools as expected. Please also refer to our Form 10-K, Forms 10-Q, Forms 8-K and other filings with the U.S. Securities and Exchange Commission for additional information on these factors and other factors that could cause actual results to differ materially from the forward-looking statements. FEI assumes no duty to update forward-looking statements.