LINSEIS to commercialize ICMAB’s patented contactless thermal conductivity measurement method

Researchers at ICMAB have developed a novel contactless method to measure the thermal conductivity of materials, focusing on anisotropic materials where thermal properties depend on orientation. This patented technology has now been licensed toLINSEIS Messgeräte GmbH, a leading German manufacturer of high-precision thermal analysis instrumentation, for commercial development.

Laser installation to measure thermal conductivity | ICMAB-CSIC

This innovation was developed by Sebastián Reparaz from the NANOPTO group, with significant contributions from Mariano Campoy-Quiles (co-inventor) and Kai Xu (co-inventor). The project represents a collaborative success in applied research and technology transfer at ICMAB, and was partly supported by a Proof of Concept (PoC) project (AEI).

The technology offers significant advantages over traditional measurement techniques. It is particularly suited for studying thin films and substrates—essential components in sectors such as microelectronics, thermoelectrics, and advanced thermal insulation.

A new approach to thermal conductivity

Unlike conventional methods, the ICMAB technique:

  • Requires no physical contact with the sample
  • Provides direct measurement results, eliminating the need for complex data modeling or simulations
  • Enables the assessment of direction-dependent (anisotropic) materials and thin films thermal conductivity

The method uses two advanced techniques called beam-offset frequency-domain thermoreflectance (BO-FDTR) and anisotropic thermoreflectance thermometry (ATT). It uses a focused laser beam shaped into a line (a one-dimensional heater) through diffractive optical elements, allowing accurate and flexible measurement of thermal transport.

The research team developed a compact, automated prototype validated across various materials, including layered materials such as PdSe₂ and WS₂, several polymer-based systems, bacterial nanocellulose, and silicon as reference material. The technology is expected to reduce measurement costs, simplify experimental workflows, and offer new capabilities for thermal characterization in both research and industry.

From lab to market: Partnership with LINSEIS

Following the success this patented technology, it has now been licensed to LINSEIS, a leading company in the thermal characterization with decades of experience in thermal conductivity, thermoelectric, and calorimetry instrumentation. The agreement will allow LINSEIS, with the support of the NANOPTO group, to integrate and commercialize the technology globally, making high-accuracy, contactless thermal measurements widely accessible.

About LINSEIS

Founded in 1957 and headquartered in Selb, Germany, LINSEIS specializes in advanced thermal analysis equipment. Their product portfolio includes thermal conductivity analyzers, thermoelectric devices, and calorimeters, serving diverse sectors such as semiconductors, aerospace, construction materials, pharmaceuticals, and thin films.

Interview with Sebastián Reparaz (ICMAB-CSIC)

To better understand the significance of this technology and its industrial potential, we spoke with project leader Sebastián Reparaz:

What specific challenge were you aiming to solve with this new technology, and how do you think it will change the way thermal conductivity is measured today?

The main challenge we aimed to address with this new technology was achieving accurate, contactless, and directionally resolved measurements of in-plane thermal conductivity, particularly in anisotropic and nanoscale materials where traditional techniques typically fall short.

Conventional methods often lack sensitivity to in-plane anisotropy, require physical contact or complicated heater patterns, and cannot easily resolve direction-dependent thermal properties without complex modeling. By employing beam-offset frequency-domain thermoreflectance (BO-FDTR) and Anisotropic Thermoreflectance Thermometry (ATT), our technology significantly enhances sensitivity to in-plane thermal transport, allows directional measurements without needing to rotate the sample, and accurately captures the complete thermal conductivity tensor with minimal sample preparation.

This fundamentally transforms the measurement approach, particularly benefiting studies of anisotropic, layered, or low-dimensional materials.

Which industrial sectors do you believe could benefit the most from this technology, and why?

Industries heavily reliant on thermal management and precise characterization of materials stand to benefit most significantly from this technology. In particular, the semiconductor and electronics sectors will see substantial advantages due to improved evaluation of heat dissipation in anisotropic two-dimensional materials and high-performance integrated circuits. Additionally, battery and energy storage industries can enhance safety and performance by gaining clearer insights into heat distribution.

Biomedical and bioengineering fields, particularly those working with novel biomaterials like aligned bacterial nanocellulose, will greatly benefit, given the importance of direction-dependent thermal conductivity for implant performance and cellular behavior. Finally, the materials science and metrology sectors will experience improvements in the characterization of next-generation thermal interface materials, polymers, and composites, enabling more accurate diagnostics and advanced material designs.

How do you see the transition from laboratory research to commercialization, especially with the support of a Proof of Concept project and now the interest from a company like LINSEIS?

The transition from laboratory research to commercialization appears promising, supported by the successful validation from the Proof of Concept project (COVEQ), which has demonstrated both feasibility and industrial relevance across a diverse range of materials such as PdSe₂, bacterial nanocellulose, glass, and silicon. Collaboration with LINSEIS, an established leader in thermal measurement instrumentation, provides an ideal pathway to product development, market penetration, and global distribution.

Moving forward, we anticipate refining optical alignment and automation, developing robust software for real-time data analysis, and ultimately packaging the technology into turnkey systems for both research and industrial laboratories. This commercialization process will enable widespread adoption of high-accuracy, contactless, and directionally resolved thermal measurements, addressing critical needs across various industries.

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